• 半导体器件bàn dǎo tǐ qì jiàn semiconductor device; semiconductor apparatus
• 仿形fǎng xíng profile modeling
• 归纳建模法guī nà jiàn mó fǎ inductive modeling method
• 建模jiàn mó modeling
• 建模系统jiàn mó xì tǒng modeling system; modeling
• 模塑mó sù molding; moulding; modeling
• 半导体bàn dǎo tǐ semiconductor
• 半导体变流技术bàn dǎo tǐ biàn liú jì shù Semiconductor Converting Technology
• 半导体器件工艺原理bàn dǎo tǐ qì jiàn gōng yì yuán lǐ Technological Fundamentals of Semiconductor Device
• 半导体物理bàn dǎo tǐ wù lǐ semiconductor physics
• 半导体专业实验bàn dǎo tǐ zhuān yè shí yàn Specialty Experiment of Semiconductor
• 掺杂半导体chān zá bàn dǎo tǐ doped semiconductor
• 窄禁带半导体zhǎi jìn dài bàn dǎo tǐ narrow bandgap semiconductor
• 锗半导体zhě bàn dǎo tǐ germanium semiconductor
• 锗半导体三极管zhě bàn dǎo tǐ sān jí guǎn germanium semiconductor triode
• 族半导体zú bàn dǎo tǐ group iii v semiconductor
• 安全保护装置ān quán bǎo hù zhuāng zhì safety guard; safety protection device
• 安全装置ān quán zhuāng zhì safety device; foolproofness
• 安装设备驱动程序ān zhuāng shè bèi qū dòng chéng xù device
• 备用器件bèi yòng qì jiàn BU(backup unit); standby device
• 绷弓bēng gōng device for preventing slamming of door
• 传感器原理chuán gǎn qì yuán lǐ Fundamentals of Sensors; Principle of Sensing Device
• 串行设备chuàn háng shè bèi serial device
• 打印设备dǎ yìn shè bèi PRN device
• 定点设备dìng diǎn shè bèi pointing device

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3G, 401(K), a,

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3G, 401(K), a,