Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最后用正交试验的法
肖特基器件后部封装中的压焊工艺进行了参数优化设计。
Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最后用正交试验的法
肖特基器件后部封装中的压焊工艺进行了参数优化设计。
The diode intrinsic noise temperature of some milimeter Schottky mixer diode was measured and reviewed. A measurement method was described at room and cooled temperature.
本文一些毫米波肖特基势混频
极管本征噪
温度进行了测试和分析。介绍了在常温和致冷下混频
极管本征噪
的测试
法。
明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最后用正交验的方法对肖特基器件后部封装中的压焊工艺进行了参数优化设
。
The diode intrinsic noise temperature of some milimeter Schottky mixer diode was measured and reviewed. A measurement method was described at room and cooled temperature.
对一些毫米波肖特基势混频
极管
征噪声温度进行了测
析。介绍了在常温
致冷下混频
极管
征噪声的测
方法。
声明:以上例句、词性类均由互联网资源自动生成,部
未经过人工审核,其表达内容亦不代表
软件的观点;若发现问题,欢迎向我们指正。
Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最后用正交试验的方法对肖特基器件后部封装中的压焊工艺进行了参数优化设计。
The diode intrinsic noise temperature of some milimeter Schottky mixer diode was measured and reviewed. A measurement method was described at room and cooled temperature.
本文对一些毫米波肖特基势混频极管本征噪声温度进行了测试和分析。介绍了在常温和致冷下混频
极管本征噪声的测试方法。
声明:以上、词性分
互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最后用正交试验的方法对肖特基器件后部封装中的压焊工艺参数优化设计。
The diode intrinsic noise temperature of some milimeter Schottky mixer diode was measured and reviewed. A measurement method was described at room and cooled temperature.
本文对一些毫米波肖特基势混频极管本征噪声
度
测试
分析。介绍
在
致冷下混频
极管本征噪声的测试方法。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最后用正交试验法对肖特基器件后部封装中
压焊工艺进行了参数优化设计。
The diode intrinsic noise temperature of some milimeter Schottky mixer diode was measured and reviewed. A measurement method was described at room and cooled temperature.
本文对一些毫米波肖特基势混频极管本征噪
温度进行了测试和分析。介绍了在常温和致冷下混频
极管本征噪
测试
法。
:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件
观点;若发现问题,欢迎向我们指正。
Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最用正交试验的方法对肖特基器件
封装中的压焊工艺进行了参数优化设计。
The diode intrinsic noise temperature of some milimeter Schottky mixer diode was measured and reviewed. A measurement method was described at room and cooled temperature.
文对一些毫米波肖特基势混频
极管
声温度进行了测试和分析。介绍了在常温和致冷下混频
极管
声的测试方法。
声明:以上例句、词性分类均由互联网资源自动生成,分未经过人工审核,其表达内容亦不代表
软件的观点;若发现问题,欢迎向我们指正。
Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最后用正交试验的方法对肖特基器件后部封装中的压焊工了参数优化设计。
The diode intrinsic noise temperature of some milimeter Schottky mixer diode was measured and reviewed. A measurement method was described at room and cooled temperature.
本文对一些毫米波肖特基势混频极管本征噪声
度
了测试
分析。介绍了在常
冷下混频
极管本征噪声的测试方法。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最后用正的方法对肖特基器件后部封装中的压焊工艺进行了参数优化设计。
The diode intrinsic noise temperature of some milimeter Schottky mixer diode was measured and reviewed. A measurement method was described at room and cooled temperature.
本文对一些毫米波肖特基势混频极管本征噪声温度进行了测
和分析。介绍了在常温和致冷下混频
极管本征噪声的测
方法。
声明:句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最后用正交试验的方法对肖特基器件后部封装中的压焊工艺了参数优化设计。
The diode intrinsic noise temperature of some milimeter Schottky mixer diode was measured and reviewed. A measurement method was described at room and cooled temperature.
本文对一波肖特基势混频
极管本征噪声温
了测试和分析。介绍了在常温和致冷下混频
极管本征噪声的测试方法。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最后用正交试验的方法对肖特基器件后部封装中的艺进行了参数优化设计。
The diode intrinsic noise temperature of some milimeter Schottky mixer diode was measured and reviewed. A measurement method was described at room and cooled temperature.
本文对一些毫米波肖特基势频
极管本征噪声温度进行了测试和分析。介绍了在常温和致
频
极管本征噪声的测试方法。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。