Melting seal packaging,a transparent window makes the sorbent seeable.

融合，可以通过透明窗观察吸附剂的状态。

Pavier M.Standing P.Cutler A.Sawle C.Blake A.

用小型散热对DirectFET功率MOSFET进行双面散热(M.

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验的方法对肖特基件后部中的压焊工艺进行了参数优化设计。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本标准用于确定气密的表面安件（SMD）的湿气敏感度等级。

Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.

吸热和数据, 衬垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少的, 断掉的, 未电镀引线.

It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.

用于将完毕的液体内酯豆腐加热成型及巴氏灭菌。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型件上的焊料球质量较小，加上体较薄，热量传送通过件速度很快。

Melting seal packaging,a transparent window makes the sorbent seeable.

封装，可以通过透明窗观察吸附剂的状态。

Pavier M.Standing P.Cutler A.Sawle C.Blake A.

用小型散热器对DirectFET封装功率MOSFET进行双面散热(M.

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验的方法对肖特基器件后部封装中的压焊工艺进行了参数优化设计。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本标准用确定气密封装的表面安装器件（SMD）的湿气敏感度等级。

Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.

吸热和封装数据, 衬垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少的, 断掉的, 未电镀引线.

It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.

用将封装完毕的液体内酯豆腐加热成型及巴氏灭菌。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

型封装器件上的焊料球质量较小，加上封装体较薄，热量传送通过器件速度很快。

Melting seal packaging,a transparent window makes the sorbent seeable.

融合封装，可以通过透明吸附剂的状态。

Pavier M.Standing P.Cutler A.Sawle C.Blake A.

用小型散热器对DirectFET封装功率MOSFET进行双面散热(M.

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验的方法对肖特基器件后部封装中的压焊工艺进行了参数优化设计。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本标准用于确定气密封装的表面安装器件（SMD）的湿气敏感度等级。

Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.

吸热和封装数据, 衬垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少的, 断掉的, 未电镀引线.

It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.

用于将封装完毕的液体内酯热成型及巴氏灭菌。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型封装器件上的焊料球质量较小，上封装体较薄，热量传送通过器件速度很快。

Melting seal packaging,a transparent window makes the sorbent seeable.

融合封装，可以通过透明窗观察的状态。

Pavier M.Standing P.Cutler A.Sawle C.Blake A.

用小型散热器对DirectFET封装功率MOSFET进行双面散热(M.

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验的方法对肖特基器件后部封装中的压焊工艺进行了参数优化设计。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本标准用于确定气密封装的表面安装器件（SMD）的湿气敏感度等级。

Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.

热和封装数据, 衬垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少的, 断掉的, 未电镀引线.

It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.

用于将封装完毕的液豆腐加热成型及巴氏灭菌。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型封装器件上的焊料球质量较小，加上封装较薄，热量传送通过器件速度很快。

Melting seal packaging,a transparent window makes the sorbent seeable.

融合封装，可以通过透明窗观察吸附剂状态。

Pavier M.Standing P.Cutler A.Sawle C.Blake A.

用小型散热器对DirectFET封装功率MOSFET进行双散热(M.

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验方法对肖特基器件后部封装中压焊工艺进行了参数优化设计。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

用于确定气密封装安装器件（SMD）湿气敏感度等级。

Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.

吸热和封装数据, 衬垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少, 断掉, 未电镀引线.

It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.

用于将封装完毕液体内酯豆腐加热成型及巴氏灭菌。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型封装器件上焊料球质量较小，加上封装体较薄，热量传送通过器件速度很快。

Melting seal packaging,a transparent window makes the sorbent seeable.

融合封装，可以通过透明窗观察吸附剂。

Pavier M.Standing P.Cutler A.Sawle C.Blake A.

小型散热器对DirectFET封装功率MOSFET进行双面散热(M.

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后正交试验方法对肖特基器件后部封装中压焊工艺进行了参数优化设计。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本标准于确定气密封装表面安装器件（SMD）湿气敏感度等级。

Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.

吸热和封装数据, 衬垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少, 断掉, 未电镀引线.

It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.

于将封装液体内酯豆腐加热成型及巴氏灭菌。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型封装器件上焊料球质量较小，加上封装体较薄，热量传送通过器件速度很快。

Melting seal packaging,a transparent window makes the sorbent seeable.

融合封，可以通过透明窗观察吸附剂的状态。

Pavier M.Standing P.Cutler A.Sawle C.Blake A.

用小型散热对DirectFET封功率MOSFET进行双面散热(M.

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验的方法对肖特基件后部封中的压焊工艺进行了参数优。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本标准用于确定气密封的表面件（SMD）的湿气敏感度等级。

Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.

吸热和封数据, 衬垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少的, 断掉的, 未电镀引线.

It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.

用于将封完毕的液体内酯豆腐加热成型及巴氏灭菌。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型封件上的焊料球质量较小，加上封体较薄，热量传送通过件速度很快。

Melting seal packaging,a transparent window makes the sorbent seeable.

融合封装，可以通过透明窗观察吸附剂的状态。

Pavier M.Standing P.Cutler A.Sawle C.Blake A.

用小型散热器对DirectFET封装功率MOSFET进行双面散热(M.

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验的方法对肖特基器件后部封装中的压工艺进行了参数优化设计。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本标准用于确定气密封装的表面安装器件（SMD）的湿气敏感度等级。

Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.

吸热和封装数据, 衬垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少的, 断掉的, 未电镀引线.

It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.

用于将封装完毕的液体内酯豆腐加热成型及巴氏灭菌。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型封装器件上的质量较小，加上封装体较薄，热量传送通过器件速度很快。

Melting seal packaging,a transparent window makes the sorbent seeable.

融合封装，可以通过观察吸附剂的状态。

Pavier M.Standing P.Cutler A.Sawle C.Blake A.

用小型散器对DirectFET封装功率MOSFET进行双面散(M.

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验的方法对肖特基器件后部封装中的压焊工艺进行了参数优化设计。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本标准用于确定气密封装的表面安装器件（SMD）的湿气敏感度等级。

Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.

吸和封装数据, 衬垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少的, 断掉的, 未电镀引线.

It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.

用于将封装完毕的液体内酯豆腐型及巴氏灭菌。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型封装器件上的焊料球质量较小，上封装体较薄，量传送通过器件速度很快。