Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环基体,间苯二胺和二氨基二苯甲烷的低融点混合物
固化剂,铜粉
导电填料,制备了热固化各向同性导电胶。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环基体,间苯二胺和二氨基二苯甲烷的低融点混合物
固化剂,铜粉
导电填料,制备了热固化各向同性导电胶。
声明:以上例句、词性分类均网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂基体,间苯二胺和二氨基二苯甲烷的低融点混合物
固化剂,铜粉
导电填料,制备了热固化各向同性导电胶。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂基体,间苯二胺和二氨基二苯甲烷的低融点混合物
,铜粉
导电
,
备了热
各向同性导电胶。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂基体,间苯二胺和二氨基二苯甲烷的低融点混合物
固化剂,铜粉
导电填料,制备了热固化各向同性导电胶。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂基体,间苯二胺和二氨基二苯甲烷的低融点混合物
,铜粉
导电
,
备了热
各向同性导电胶。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂基体,间苯二胺和二氨基二苯甲烷的低融点混合物
固化剂,铜粉
导电填料,制备了热固化各向同性导电胶。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂体,间苯
胺和
苯甲烷的低融点混合物
固化剂,铜粉
导电填料,制备了热固化各向同性导电胶。
声明:以上例句、词性分类均由互联网资源自动生成,部分未工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂基体,间苯二胺和二氨基二苯甲烷的
混合物
固
剂,铜粉
导电填料,制备了热固
同性导电胶。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观;若发现问题,欢迎
我们指正。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂基体,间
二胺和二氨基二
的低融点混合物
固化剂,铜粉
填料,制备了热固化各向同
胶。
声明:以上例句、词分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。