You need a strong adhesive to bond wood to metal.

需要强力胶才能把木料粘在金属上。

This adhesive must be applied to both surfaces which are to be bonded together.

要粘接两个面都必须涂上这种黏合剂。

This glue makes a good firm bond.

这种胶水粘得很结实。

The peptide bond is the same as the imido bond of biuret.

处于等电点状白质加热时凝固最完全、最迅速。

The bonds are redeemable by annual drawings.

公债每抽签偿还。

The relationship between bond valence and bond covalency has been investigated by a semiempirical method.

用一种半经验方法研究了固体材料中键电荷与键共价性关系。

The whisky was taken to bonded warehouses at Port Dundee.

威士忌酒已送到邓迪港保稅仓库。

All perpends are to be strictly true and square and the whole properly bonded together.

所有直角处必须精确方正，且整体要粘合妥当。

Compared with diolefine rubber,EPDM has less double bond.

与二烯烃橡胶相比,EPDM双键很少。

This glue is our new product and makes a firmer bond.

"这种胶水是我们新产品,粘结力很强。"

This new glue makes a firmer bond.

新胶水粘得牢。

Or they can buy unsell (and sell) existing bonds.

他们也可以买卖现有债券。

We entered into a solemn bond.

我们缔结了一份正式合约。

Fabrics are produced by bonding yarns together in terms of weaving or knitting, lacemaking, braiding or felting.

在网状结构以及处理组合、烘乾、热定形等装订设备辅助下，非编织布料也可被使用。

The composition of butadiene polyperoxide is analyzed.The energy of explosion reactions is calculated by bond energy method.

分析了丁二烯聚过氧化物组成,用键能法计算了爆炸反应能量,结果与实例相符。

Grinding paper with self bonding nappa base (for fixinf on cloth ) with grain P40 up to P100.

研磨编织abrasive (sand) complect:1. 以寛115毫米氯丁(二烯)橡胶为底织物粘贴在工具上.Cloth 2.P40Z至P100砂纸粘贴再皮革上.

In addition,The general macrograph characters of spalling of bonding layer and shallow working lining,and their causes were described.

总结了轧辊磨损预报模型研究现状,并详细介绍了典型磨损预报模型,最后展望了冷轧辊研究工作方向。

The great viscosimetry onusseit, its solid water with high, in the small, cohesion, bond strength can vary widely.

粘度大胶粘剂，其固体含里高，水分少，内聚力大，粘结强度也大。

The resultant ionized bond can be cleaved by a hemi-heterolysis process, affording a cation and a neutral radical.

生成离子化键能由半异裂过程而开裂，提供一个正离子一个中性游离基。

The same forces and mechanisms responsible for size enlargement in roller compaction are responsible for bond formation during tabletting.

碾压中施加于颗粒增大力机理也用于压片粘合成型。