Nickel underplating prevents the migration between tin or gold platings and the base material.
垫板镀镍可防止在镀
或
基料之间
移动。
dù xī
- tinning
- tinn
- tinplating
Mainly discuss fluorborate terne electroplating solution in use for PCB fabrication.
主要论述印制线路板
产中所用氟硼酸盐镀铅溶液。
The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.
镀板合是镀后在加热熔融处理过程中通过热扩散在基板之间成一种属间化合物,因此,合成原板和镀都有很大关系。
声明：以上例句、词性分类均由互联网资源自动
成，部分未经过人工审核，其表达内容亦不代表本软件
观点；若发现问题，欢迎向我们指正。
用户正在搜索
humanities, humanity, humanization, humanize, humanized, humankind, humanly, humanness, humanoid, humanoscope,
相似单词
镀镍层, 镀铅锡铁板, 镀青铜, 镀通孔, 镀铜, 镀锡, 镀锡薄钢板, 镀锡的, 镀锡铁板, 镀锡铁皮,
dù xī
- tinning
- tinn
- tinplating
Nickel underplating prevents the migration between tin or gold platings and the base material.
垫
镀镍可防止在镀或层与基料之间的移动。
Mainly discuss fluorborate terne electroplating solution in use for PCB fabrication.
主要论述印制线路生产中所用的氟硼酸盐镀铅溶液。
The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.
镀
层是镀后在加
处理过程中通过扩散在基与层之间生成的一种属间化物,因此,层的生成与原和镀层都有很大关系。
声明：以上例句、词性分类均由互联网资源自动生成，部分未经过人工审核，其表达内容亦不代表本软件的观点；若发现问题，欢迎向我们指正。
用户正在搜索
humblebee, humble-bee, humbleness, humbler, humbling, humblingly, humbly, Humboldt, Humboldt current, humboldtine,
相似单词
镀镍层, 镀铅锡铁板, 镀青铜, 镀通孔, 镀铜, 镀锡, 镀锡薄钢板, 镀锡的, 镀锡铁板, 镀锡铁皮,
dù xī
- tinning
- tinn
- tinplating
Nickel underplating prevents the migration between tin or gold platings and the base material.
垫板镀镍可防止在镀或金层与基料之间的移动。
Mainly discuss fluorborate terne electroplating solution in use for PCB fabrication.
主要论述印制线路板生产
所用的氟硼酸盐镀
液。
The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.
镀板合金层是镀后在加热熔融处理过
过热扩散在基板与层之间生成的一种金属间化合物,因此,合金层的生成与原板和镀层都有很大关系。
声明：以上例句、词性分类均由互联网资源自动生成，部分未经过人工审核，其表达内容亦不代表本软件的观点；若发现问题，欢迎向我们指正。
用户正在搜索
humeri, humerus, humic, humic acid, humicap, humicolin, humicolous, humics, humid, humidex,
相似单词
镀镍层, 镀铅锡铁板, 镀青铜, 镀通孔, 镀铜, 镀锡, 镀锡薄钢板, 镀锡的, 镀锡铁板, 镀锡铁皮,
dù xī
- tinning
- tinn
- tinplating
Nickel underplating prevents the migration between tin or gold platings and the base material.
垫板镀镍可防止在镀或金层与基料之间的移动。
Mainly discuss fluorborate terne electroplating solution in use for PCB fabrication.
主要论述印制线路板生产所用的氟硼酸盐镀
。
The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.
镀板合金层是镀后在加热熔融处理
通热扩散在基板与层之间生成的一种金属间化合物,因此,合金层的生成与原板和镀层都有很大关系。
声明：以上例句、词性分类均由互联网资源自动生成，部分未经
人工审核，其表达内容亦不代表本软件的观点；若发现问题，欢迎向我们指正。
用户正在搜索
humidness, humidogene, humidor, humidostat, humiffication, humification, humified, humifuse, humify, humifying,
相似单词
镀镍层, 镀铅锡铁板, 镀青铜, 镀通孔, 镀铜, 镀锡, 镀锡薄钢板, 镀锡的, 镀锡铁板, 镀锡铁皮,
dù xī
- tinning
- tinn
- tinplating
Nickel underplating prevents the migration between tin or gold platings and the base material.
垫板
镍
在或金与基料之间的移动。
Mainly discuss fluorborate terne electroplating solution in use for PCB fabrication.
主要论述印制线路板生产中所用的氟硼酸盐铅溶液。
The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.
板合金是后在加热熔融处理过程中通过热扩散在基板与之间生成的一种金属间化合物,因此,合金的生成与原板
都有很大关系。
声明：以上例句、词性分类均由互联网资源自动生成，部分未经过人工审核，其表达内容亦不代表本软件的观点；若发现问题，欢迎向我们指正。
用户正在搜索
humite, humiture, humivore, hummaul, hummel, hummeler, hummer, humming, humming bird, hummingbird,
相似单词
镀镍层, 镀铅锡铁板, 镀青铜, 镀通孔, 镀铜, 镀锡, 镀锡薄钢板, 镀锡的, 镀锡铁板, 镀锡铁皮,
dù xī
- tinning
- tinn
- tinplating
Nickel underplating prevents the migration between tin or gold platings and the base material.
垫板镀镍可防止在镀或层与基料之间的移动。
Mainly discuss fluorborate terne electroplating solution in use for PCB fabrication.
主
印制线路板生产中所用的氟硼酸盐镀铅溶液。
The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.
镀板合层是镀后在加热熔融处理过程中通过热扩散在基板与层之间生成的一
间化合物,因此,合层的生成与原板和镀层都有很大关系。
声明：以上例句、词性分类均由互联网资源自动生成，部分未经过人工审核，其表达内容亦不代表本软件的观点；若发现问题，欢迎向我们指正。
用户正在搜索
humoral, humoralism, humoresque, humorism, humorist, humoristic, humorless, humorlessly, humorlessness, humorology,
相似单词
镀镍层, 镀铅锡铁板, 镀青铜, 镀通孔, 镀铜, 镀锡, 镀锡薄钢板, 镀锡的, 镀锡铁板, 镀锡铁皮,
dù xī
- tinning
- tinn
- tinplating
Nickel underplating prevents the migration between tin or gold platings and the base material.
垫板镀镍可防止在镀或金层与基料之间的移动。
Mainly discuss fluorborate terne electroplating solution in use for PCB fabrication.
主要论述印制线路板生产所用的氟硼酸盐镀。
The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.
镀板合金层是镀后在加热熔融处理通热扩散在基板与层之间生成的一种金属间化合物,因此,合金层的生成与原板和镀层都有很大关系。
声明：以上例句、词性分类均由互联网资源自动生成，部分未经人工审核，其表达内容亦不代表本软件的观点；若发现问题，欢迎向我们指正。
用户正在搜索
humourous, humourously, humoursome, humous, hump, humpback, humpback whale, humpbacked, humped, humper,
相似单词
镀镍层, 镀铅锡铁板, 镀青铜, 镀通孔, 镀铜, 镀锡, 镀锡薄钢板, 镀锡的, 镀锡铁板, 镀锡铁皮,
dù xī
- tinning
- tinn
- tinplating
Nickel underplating prevents the migration between tin or gold platings and the base material.
板镀镍可防止在镀或金层与基料之间的移动。
Mainly discuss fluorborate terne electroplating solution in use for PCB fabrication.
主要论述印制线路板生产中所用的氟硼酸盐镀铅溶液。
The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.
镀板合金层是镀后在加热熔融处理过程中通过热扩散在基板与层之间生成的一种金属间化合物,因此,合金层的生成与原板和镀层都有很
。
声明：以上例
、词性分类均由互联网资源自动生成，部分未经过人工审核，其表达内容亦不代表本软件的观点；若发现问题，欢迎向我们指正。
用户正在搜索
humuladienone, humulane, humulene, humulin, humulite, humulol, humulone, humulus, humungous, humus,
相似单词
镀镍层, 镀铅锡铁板, 镀青铜, 镀通孔, 镀铜, 镀锡, 镀锡薄钢板, 镀锡的, 镀锡铁板, 镀锡铁皮,
dù xī
- tinning
- tinn
- tinplating
Nickel underplating prevents the migration between tin or gold platings and the base material.
垫
可防止在或金层与基料之间的移动。
Mainly discuss fluorborate terne electroplating solution in use for PCB fabrication.
主要论述印制线路生产中所用的氟硼酸盐铅溶液。
The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.
合金层是后在加热熔融处理过程中通过热扩散在基与层之间生成的一种金属间化合物,因此,合金层的生成与原和层
有
大关系。
声明：以上例句、词性分类均由互联网资源自动生成，部分未经过人工审核，其表达内容亦不代表本软件的观点；若发现问题，欢迎向我们指正。
用户正在搜索
hundi, hundred, hundredfold, hundred-percent, hundredpercenter, hundred-percenter, hundreds, hundredth, hundredthly, hundredweight,
相似单词
镀镍层, 镀铅锡铁板, 镀青铜, 镀通孔, 镀铜, 镀锡, 镀锡薄钢板, 镀锡的, 镀锡铁板, 镀锡铁皮,