Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交验的方法肖特基器件后部封装中的压焊工艺进行了参数优化设计。

The diode intrinsic noise temperature of some milimeter Schottky mixer diode was measured and reviewed. A measurement method was described at room and cooled temperature.

一些毫米波肖特基势混频极管征噪声温度进行了分析。介绍了在常温致冷下混频极管征噪声的方法。