The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.
由于装器件上的焊料球质
较小,加上
装体较薄,
送通过器件速度很快。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
56. Question: In PCBA, how can we prevent solder wicking? Answer: By controlling the solder volume, optimizing the component lead length, and adjusting the soldering temperature and time to avoid excessive solder climbing up the leads.
56. 问题:在 PCBA 中,我们如何防止芯吸?答案: 通过控制料量,优化元件引线长度,调整
温度和时间,以避免过多的
料爬上引线。
51. Question: How does the cleanliness of the PCB surface impact the soldering process in PCBA? Answer: A dirty PCB surface can prevent proper wetting of the solder, leading to poor solder joints, increased resistance, and possible electrical failures.
51. 问题:PCB 表面的清洁度如何影响 PCBA 中的过程?答案: 肮脏的 PCB 表面会妨碍
料的适当润湿,从而导致
点
良、电阻增加和可能的电气故障。