The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.
由于微型封装器件上的焊,
上封装体
薄,热
传送通过器件速度很快。
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56. Question: In PCBA, how can we prevent solder wicking? Answer: By controlling the solder volume, optimizing the component lead length, and adjusting the soldering temperature and time to avoid excessive solder climbing up the leads.
56. 问题:在 PCBA 中,我们如何防止芯吸?答案: 通过控制焊料量,优化元件引线长,调整焊接
时间,以避免过多
焊料爬上引线。
51. Question: How does the cleanliness of the PCB surface impact the soldering process in PCBA? Answer: A dirty PCB surface can prevent proper wetting of the solder, leading to poor solder joints, increased resistance, and possible electrical failures.
51. 问题:PCB 表面清洁
如何影响 PCBA 中
焊接过程?答案: 肮脏
PCB 表面会妨碍焊料
适当润湿,从而导致焊点不良、电阻增加
可能
电气故障。