A blowhole will form as a result of an out-gasing of a void in the BGA sphere during the reflow process.
在迴焊
程中,
BGA
内孔隙有气体溢出而形成吹孔.
阵列封装A blowhole will form as a result of an out-gasing of a void in the BGA sphere during the reflow process.
在迴焊程中,BGA内孔隙有气体溢出而形成吹孔.
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工审核，其表达内容亦不代表本软件的观点；若发现问题，欢迎向我们指正。
