The invention relates to thermocuring isotropic conductive adhesive and a preparation method thereof.
本发明涉及一种热固化各向同性导电胶及其制备法。
The invention relates to thermocuring isotropic conductive adhesive and a preparation method thereof.
本发明涉及一种热固化各向同性导电胶及其制备法。
Macroscopic deviations from isotropy occur due to bedding, schistosity and also sometimes fracturing.
与各向同性相差很大情况往往产生于层理,片理,某些时候则由于断裂所
。
It leads to one simple equation, which, in the isotropic case, is the bipotential equation .
因为它可以出一个简单
,在各向同性
情况下,这个简单
是一个双位势
。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂为基体,间苯二胺和二氨基二苯甲烷低融点混合物为固化剂,铜粉为导电填料,制备了热固化各向同性导电胶。
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