Nickel underplating prevents the migration between tin or gold platings and the base material.
垫
镀镍可防止在镀
或金层与基料
的移动。
dù xī de
tinnedMainly discuss fluorborate terne electroplating solution in use for PCB fabrication.
主要论述印制线路
产中所用的氟硼酸盐镀铅溶液。
The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.
镀合金层是镀后在加热熔融处理过程中通过热扩散在基与层成的一种金属化合物,因此,合金层的成与原和镀层都有很大关系。
声明：以上例句、词性分类均由互联网资源自动
成，部分未经过人工审核，其表达内容亦不代表本软件的观点；若发现问题，欢迎向我们指正。
用户正在搜索
amphidiploid, amphidiploidy, amphidisc, Amphidiscophora, Amphidiscosa, amphidrome, amphidromia, amphierotism, amphigamous, amphigamy,
相似单词
镀青铜, 镀通孔, 镀铜, 镀锡, 镀锡薄钢板, 镀锡的, 镀锡铁板, 镀锡铁皮, 镀锡线, 镀锌,
dù xī de
tinnedNickel underplating prevents the migration between tin or gold platings and the base material.
垫板镀镍可防止在镀或金层与基料之间
。
Mainly discuss fluorborate terne electroplating solution in use for PCB fabrication.
主要论述印制线路板生产中所用氟硼酸盐镀铅溶液。
The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.
镀板
金层是镀后在加热熔融处理过程中通过热扩散在基板与层之间生成一种金属间
,因此,金层生成与原板和镀层都有很大关系。
声明：以上例句、词性分类均由互联网资源自
生成，部分未经过人工审核，其表达内容亦不代表本软件
观点；若发现问题，欢迎向我们指正。
用户正在搜索
amphigynous, amphihaploid, amphikaryon, amphilepsis, Amphilestidae, amphileucemic, amphileukemic, Amphilinidea, amphimacer, Amphimerus,
相似单词
镀青铜, 镀通孔, 镀铜, 镀锡, 镀锡薄钢板, 镀锡的, 镀锡铁板, 镀锡铁皮, 镀锡线, 镀锌,
dù xī de
tinnedNickel underplating prevents the migration between tin or gold platings and the base material.
垫板
镍
在或金
与基料之间的移动。
Mainly discuss fluorborate terne electroplating solution in use for PCB fabrication.
主要论述印制线路板生产中所用的氟硼酸盐铅溶液。
The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.
板合金是后在加热熔融处理过程中通过热扩散在基板与之间生成的一种金属间化合物,因此,合金的生成与原板
都有很大关系。
声明：以上例句、词性分类均由互联网资源自动生成，部分未经过人工审核，其表达内容亦不代表本软件的观点；若发现问题，欢迎向我们指正。
用户正在搜索
amphinucleolus, amphinucleus, amphion, amphiont, amphioxea, amphioxus, amphipath, amphipathic, amphipeptone, amphi-permeability,
相似单词
镀青铜, 镀通孔, 镀铜, 镀锡, 镀锡薄钢板, 镀锡的, 镀锡铁板, 镀锡铁皮, 镀锡线, 镀锌,
dù xī de
tinnedNickel underplating prevents the migration between tin or gold platings and the base material.
垫镀镍可防止在镀或
层与基料之间的移动。
Mainly discuss fluorborate terne electroplating solution in use for PCB fabrication.
主要论述印制线路生产中所用的氟硼酸盐镀铅溶液。
The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.
镀层是镀后在加
处理过程中通过扩散在基与层之间生成的一种属间化物,因此,层的生成与原和镀层都有很大关系。
声明：以上例句、词性分类均由互联网资源自动生成，部分未经过人工审核，其表达内容亦不代表本软件的观点；若发现问题，欢迎向我们指正。
用户正在搜索
amphipolyploid, amphiporids, amphiprostyle, amphiprostylos, amphiprotic, Amphirrhina, amphisapropel, amphisarca, amphisbaena, amphisbaenian,
相似单词
镀青铜, 镀通孔, 镀铜, 镀锡, 镀锡薄钢板, 镀锡的, 镀锡铁板, 镀锡铁皮, 镀锡线, 镀锌,
dù xī de
tinnedNickel underplating prevents the migration between tin or gold platings and the base material.
垫板镀镍可防止在镀或金层与基料之间移动。
Mainly discuss fluorborate terne electroplating solution in use for PCB fabrication.
主要论
线路板生产中所用氟硼酸盐镀铅溶液。
The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.
镀板合金层是镀后在加热熔融处理过程中通过热扩散在基板与层之间生成
金属间化合物,因此,合金层生成与原板和镀层都有很大关系。
声明：以上例句、词性分类均由互联网资源自动生成，部分未经过人工审核，其表达内容亦不代表本软件观点；若发现问题，欢迎向我们指正。
用户正在搜索
amphistyly, amphitene, amphiterotoky, amphithalite, amphithallism, amphitheater, amphitheatral, amphitheatre, amphitheatric, amphitheatrical,
相似单词
镀青铜, 镀通孔, 镀铜, 镀锡, 镀锡薄钢板, 镀锡的, 镀锡铁板, 镀锡铁皮, 镀锡线, 镀锌,
dù xī de
tinnedNickel underplating prevents the migration between tin or gold platings and the base material.
垫板
防止在或金与基料之间的移动。
Mainly discuss fluorborate terne electroplating solution in use for PCB fabrication.
主要论述印制线路板生产中所用的氟硼酸盐铅溶液。
The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.
板合金是后在加热熔融处理过程中通过热扩散在基板与之间生成的一种金属间化合物,因此,合金的生成与原板和
有很大关系。
声明：以上例句、词性分类均由互联网资源自动生成，部分未经过人工审核，其表达内容亦不代表本软件的观点；若发现问题，欢迎向我们指正。
用户正在搜索
ampiclla, ampiclox, amping, ample, amplectant, ampleness, ampler, amplexicaul, amplexicaul leaf, amplexiform,
相似单词
镀青铜, 镀通孔, 镀铜, 镀锡, 镀锡薄钢板, 镀锡的, 镀锡铁板, 镀锡铁皮, 镀锡线, 镀锌,
dù xī de
tinnedNickel underplating prevents the migration between tin or gold platings and the base material.
垫板镍可防止在或金层与基料之间的移动。
Mainly discuss fluorborate terne electroplating solution in use for PCB fabrication.
主要论述印制线路板生产中所用的氟硼
铅溶液。
The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.
板合金层是后在加熔融处理
程中通
散在基板与层之间生成的一种金属间化合物,因此,合金层的生成与原板和层都有很大关系。
声明：以上例句、词性分类均由互联网资源自动生成，部分未经
人工审核，其表达内容亦不代表本软件的观点；若发现问题，欢迎向我们指正。
用户正在搜索
amplificatory, amplifier, amplifier-chain, amplifier-filter, amplifierinverter, amplifier-inverter, amplifier-rectifier, amplifilter, amplify, amplifying,
相似单词
镀青铜, 镀通孔, 镀铜, 镀锡, 镀锡薄钢板, 镀锡的, 镀锡铁板, 镀锡铁皮, 镀锡线, 镀锌,
dù xī de
tinnedNickel underplating prevents the migration between tin or gold platings and the base material.
垫板镍可防止
或金与基料之间的移动。
Mainly discuss fluorborate terne electroplating solution in use for PCB fabrication.
主要论述印制线路板生产中所用的氟硼酸盐铅溶液。
The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.
板合金
热熔融处理过程中通过热扩散基板与之间生成的一种金属间化合物,因此,合金的生成与原板和都有很大关系。
声明：以上例句、词性分类均由互联网资源自动生成，部分未经过人工审核，其表达内容亦不代表本软件的观点；若发现问题，欢迎向我们指正。
用户正在搜索
amplitude distortion, amplitude modulation, amplitudinous, amplituton, Amplum, amply, amporphous, ampoul, ampoule, ampoules,
相似单词
镀青铜, 镀通孔, 镀铜, 镀锡, 镀锡薄钢板, 镀锡的, 镀锡铁板, 镀锡铁皮, 镀锡线, 镀锌,
dù xī de
tinnedNickel underplating prevents the migration between tin or gold platings and the base material.
垫板镀镍可防止在镀或金层与基料之间的移动。
Mainly discuss fluorborate terne electroplating solution in use for PCB fabrication.
主要论述印制线路板生产
所用的氟硼酸盐镀
液。
The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.
镀板合金层是镀后在加热熔融处理过
过热扩散在基板与层之间生成的一种金属间化合物,因此,合金层的生成与原板和镀层都有很大关系。
声明：以上例句、词性分类均由互联网资源自动生成，部分未经过人工审核，其表达内容亦不代表本软件的观点；若发现问题，欢迎向我们指正。
用户正在搜索
ampullary, ampulliform, ampullocyst, amputate, amputation, amputator, amputee, amputees, ampyrimine, ampyrone,
相似单词
镀青铜, 镀通孔, 镀铜, 镀锡, 镀锡薄钢板, 镀锡的, 镀锡铁板, 镀锡铁皮, 镀锡线, 镀锌,