Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最后用正交试验的方法对肖特基器件后部封装中的压焊工艺进行了参数优化设计。
Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最后用正交试验的方法对肖特基器件后部封装中的压焊工艺进行了参数优化设计。
The diode intrinsic noise temperature of some milimeter Schottky mixer diode was measured and reviewed. A measurement method was described at room and cooled temperature.
文对一些毫米波肖特基
征噪声温度进行了测试和分析。介绍了在常温和致冷下
征噪声的测试方法。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表软件的观点;若发现问题,欢迎向我们指正。
Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最后用正的方法对肖特基器件后部封装中的压焊工艺进行了参数优化设计。
The diode intrinsic noise temperature of some milimeter Schottky mixer diode was measured and reviewed. A measurement method was described at room and cooled temperature.
本文对一些毫米波肖特基势混频极管本征噪声温度进行了测
和分析。介绍了在常温和致冷下混频
极管本征噪声的测
方法。
声明:句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最后用正交试验的方法对肖特基器件后部封装中的压进行了参数优化设计。
The diode intrinsic noise temperature of some milimeter Schottky mixer diode was measured and reviewed. A measurement method was described at room and cooled temperature.
本文对一些毫米波肖特基势混频极管本征噪声温度进行了测试和分析。介绍了在常温和
混频
极管本征噪声的测试方法。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最后用验的方法对肖特基器件后部封装中的压焊工艺进行了参数优化设计。
The diode intrinsic noise temperature of some milimeter Schottky mixer diode was measured and reviewed. A measurement method was described at room and cooled temperature.
本文对一些毫米波肖特基势混频极管本征噪声温度进行了测
和分析。介绍了在常温和致冷下混频
极管本征噪声的测
方法。
声明:以、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指
。
Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最后用正交试验的方法对肖特基器件后部封装中的压焊工艺进行了参数优化设计。
The diode intrinsic noise temperature of some milimeter Schottky mixer diode was measured and reviewed. A measurement method was described at room and cooled temperature.
本文对一些毫米波肖特基势混频极管本征噪声温度进行了测试和分析。介绍了在常温和致冷下混频
极管本征噪声的测试方法。
声明:以上例句、词性分类均由资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最后用正交验的
法
特基器件后部封装中的压焊工艺进行了参数优化设计。
The diode intrinsic noise temperature of some milimeter Schottky mixer diode was measured and reviewed. A measurement method was described at room and cooled temperature.
本文一些毫米波
特基势混频
极管本征噪声温度进行了测
和分析。介绍了在常温和致冷下混频
极管本征噪声的测
法。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最用正交试验的方法对肖特基
件
部封装中的压焊工艺进行了参数优化设计。
The diode intrinsic noise temperature of some milimeter Schottky mixer diode was measured and reviewed. A measurement method was described at room and cooled temperature.
本文对一些毫米波肖特基势混频极管本
温度进行了测试和分析。介绍了在常温和致冷下混频
极管本
的测试方法。
明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最后用验的方法对肖特基器件后部封装中的压焊工艺进行了参数优化设计。
The diode intrinsic noise temperature of some milimeter Schottky mixer diode was measured and reviewed. A measurement method was described at room and cooled temperature.
本文对一些毫米波肖特基势混频极管本征噪声温度进行了测
和分析。介绍了在常温和致冷下混频
极管本征噪声的测
方法。
声明:以、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指
。
Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最后用正交试验的方法对肖特基器件后部封装中的压焊工艺行了参数优化设计。
The diode intrinsic noise temperature of some milimeter Schottky mixer diode was measured and reviewed. A measurement method was described at room and cooled temperature.
本文对一些肖特基势混频
极管本征噪声
行了测试和分析。介绍了在常
和致冷下混频
极管本征噪声的测试方法。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最后用正交试验方法对肖特
件后部封装中
压焊工艺进行了参数优化设计。
The diode intrinsic noise temperature of some milimeter Schottky mixer diode was measured and reviewed. A measurement method was described at room and cooled temperature.
本文对一些毫米波肖特势混频
极管本征
温度进行了测试和分析。介绍了在常温和致冷下混频
极管本征
测试方法。
明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件
观点;若发现问题,欢迎向我们指正。