Figure 5. Transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co-planarity.
图5,锡高转移的效率与孔面积比率及它对回流峰共面度的影响。
Figure 5. Transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co-planarity.
图5,锡高转移的效率与孔面积比率及它对回流峰共面度的影响。
声明:句、词
分类
联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Figure 5. Transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co-planarity.
图5,锡的效率与孔面积比率及它对回流峰共面度的影响。
声明:以上例句、词分类均由互联网资源自动生成,部分未经过人工审核,其
达内容亦
本软件的观点;若发现问题,欢迎向我们指正。
Figure 5. Transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co-planarity.
图5,锡高转移的效面积比
及它对回流峰共面度的影响。
声明:以上例句、词分类均由互联网资源自动生成,部分未经过人工审核,其
容亦不代
本软件的观点;若发现问题,欢迎向我们指正。
Figure 5. Transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co-planarity.
图5,锡高转移的效率与孔面积比率及它对回流峰共面度的影响。
声明:以、词
分
互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Figure 5. Transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co-planarity.
图5,锡高转移的效率与孔面积比率及它峰共面度的影响。
声明:以上例句、词类均由互联网资源自动生成,部
过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Figure 5. Transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co-planarity.
图5,锡高转移的效率与孔面积比率及它对回流峰共面度的影响。
声明:以上例句、词分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现
,
迎向我们指正。
Figure 5. Transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co-planarity.
图5,锡高转移效率与孔
积比率及它对回流峰共
影响。
声明:以上例句、词分类均由互联网资源
成,部分未经过人工审核,其表达内容亦不代表本软件
观点;若发现问题,欢迎向我们指正。
Figure 5. Transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co-planarity.
5,锡高转移
效率与孔面积比率及它对回流峰共面度
影响。
声明:以上例、词
分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件
观点;若发现问题,欢迎向我们指正。
Figure 5. Transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co-planarity.
图5,锡高转移的效面积比
及它对回流峰共面度的影响。
声明:以上例句、词分类均由互联网资源自动生成,部分未经过人工审核,其
容亦不代
本软件的观点;若发现问题,欢迎向我们指正。
Figure 5. Transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co-planarity.
图5,锡高转移的效率与孔面积比率及流峰共面度的影响。
声明:以上例句、词分类均由互联网资源自动生成,部分
人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。