Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最后用正交试验方法对肖特基器件后部封装中
工艺进行
参数优化
。
Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最后用正交试验方法对肖特基器件后部封装中
工艺进行
参数优化
。
The diode intrinsic noise temperature of some milimeter Schottky mixer diode was measured and reviewed. A measurement method was described at room and cooled temperature.
文对一些毫米波肖特基势混频二极管
征噪声温度进行
测试和分析。介绍
在常温和致冷下混频二极管
征噪声
测试方法。
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